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1SS226,LF(T - Toshiba

Description: Diode Array 1 Pair Series Connection 80 V 100mA Surface Mount TO-236-3, SC-59, SOT-23-3

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Symbol
1SS226,LF(T - Toshiba - PCB symbol
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PCB Footprints
1SS226,LF(T - Toshiba PCB footprint - Other - Other - 2-3F1S_2025-5
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3D Models
1SS226,LF(T - Toshiba - 3D model - Other - 2-3F1S_2025-5
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1SS226,LF(T Details

  • Manufacturer Part Number:

    1SS226,LF(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.1

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    85 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    80 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

1SS226,LF(T Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS226,LF(T) is -40°C to 125°C.
  • To ensure reliability in high-temperature applications, it is recommended to derate the voltage and current ratings of the 1SS226,LF(T) according to the temperature derating curve provided in the datasheet.
  • The maximum allowable power dissipation for the 1SS226,LF(T) is 500 mW. Exceeding this limit may cause the device to overheat and fail.
  • During soldering and assembly, it is recommended to follow the recommended soldering conditions and handling procedures outlined in the datasheet to prevent damage to the device.
  • The 1SS226,LF(T) has a human body model (HBM) ESD rating of 2 kV and a machine model (MM) ESD rating of 200 V. It is recommended to follow proper ESD handling procedures to prevent damage to the device.

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1SS226,LF(T Overview

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