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1SS294,LF(T - Toshiba

Description: Rectifier Diode Small Signal Schottky Si 45V 0.1A Automotive 3-Pin S-Mini

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Symbol
1SS294,LF(T - Toshiba - PCB symbol
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PCB Footprints
1SS294,LF(T - Toshiba PCB footprint - Other - Other - SC-59
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3D Models
1SS294,LF(T - Toshiba - 3D model - Other - SC-59
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1SS294,LF(T Details

  • Manufacturer Part Number:

    1SS294,LF(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-59, TO-236MOD, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

1SS294,LF(T Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS294,LF(T) is -40°C to 125°C.
  • The 1SS294,LF(T) should be stored and shipped in a dry, cool place, away from direct sunlight and moisture. It is recommended to use anti-static packaging and handling procedures to prevent damage from electrostatic discharge.
  • The maximum power dissipation for the 1SS294,LF(T) is 500 mW. It is recommended to use a heat sink or other cooling measures to ensure the device operates within the recommended temperature range.
  • The 1SS294,LF(T) is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. It is recommended to consult with Toshiba or a qualified distributor for information on radiation-hardened or high-reliability versions of the device.
  • The 1SS294,LF(T) should be soldered and mounted using a controlled soldering process, with a peak temperature of 260°C for 10 seconds or less. It is recommended to use a solder with a melting point of 220°C or higher, and to follow the recommended land pattern and soldering guidelines.

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1SS294,LF(T Overview

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