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1SS351-TB-E - onsemi

Description: Series connection of 2 elements in a small-sized package facilitates high-density mounting and permits 1SS351-applied equipment to be made smaller; Small interterminal capacitance (C=0.69pF typ); Small forward voltage (VF=0.23V max)

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PCB Footprints
1SS351-TB-E - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CP_SOT-23
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3D Models
1SS351-TB-E - onsemi  - 3D model - SOT23 (3-Pin) - CP_SOT-23
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1SS351-TB-E Details

  • Manufacturer Part Number:

    1SS351-TB-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59 / CP

  • Package Description:

    SC-59, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318BJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.23 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.03 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    25 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

1SS351-TB-E Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation, and consider using a thermocouple to monitor the device temperature.
  • The 1SS351-TB-E has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The 1SS351-TB-E is a commercial-grade device, but onsemi offers a radiation-hardened version (1SS351-TB-Q) that is suitable for high-reliability and aerospace applications. Contact onsemi for more information.
  • Use a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max). Ensure that the device is not exposed to temperatures above 260°C during soldering.

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1SS351-TB-E Overview

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