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1SS401(TE85L,F) - Toshiba

Description: Schottky Diodes & Rectifiers 0.3A 20V 0.16Vf Small Sig Diode

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PCB Footprints
1SS401(TE85L,F) - Toshiba PCB footprint - Other - Other - 1SS401(TE85L,F)
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3D Models
1SS401(TE85L,F) - Toshiba  - 3D model - Other - 1SS401(TE85L,F)
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1SS401(TE85L,F) Details

  • Manufacturer Part Number:

    1SS401(TE85L,F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Toshiba America Electronic Components

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.1 W

  • Rep Pk Reverse Voltage-Max:

    25 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

1SS401(TE85L,F) Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS401 is -40°C to 125°C.
  • To prevent electrostatic discharge (ESD) damage, handle the 1SS401 with an anti-static wrist strap or mat, and ensure that the device is stored in an anti-static bag or tube.
  • The maximum allowable power dissipation for the 1SS401 is 500 mW.
  • Yes, the 1SS401 is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems, due to its high-quality manufacturing process and rigorous testing.
  • To ensure proper soldering, follow the recommended soldering temperature profile and use a solder with a melting point below 260°C to prevent damage to the device.

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