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1SS413,L3M - Toshiba

Description: Schottky Diodes & Rectifiers Schottky Barrier Diode IO-.05A VR-20V

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PCB Footprints
1SS413,L3M - Toshiba PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - 1-1AH1A (SOD-923)
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3D Models
1SS413,L3M - Toshiba  - 3D model - Small Outline Diode Flat Lead - 1-1AH1A (SOD-923)
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1SS413,L3M Details

  • Manufacturer Part Number:

    1SS413,L3M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-923, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.05 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    0.1 W

  • Rep Pk Reverse Voltage-Max:

    25 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

1SS413,L3M Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 1SS413 is -40°C to 125°C.
  • To ensure reliability in high-temperature applications, it is recommended to derate the power dissipation of the 1SS413 according to the temperature derating curve provided in the datasheet.
  • The maximum allowable power dissipation for the 1SS413 is 500 mW at an ambient temperature of 25°C.
  • The 1SS413 is a surface-mount device and should be handled according to standard surface-mount assembly procedures, including using a soldering iron with a temperature of 260°C or less and avoiding excessive mechanical stress.
  • Yes, the 1SS413 is compatible with lead-free soldering, but it is recommended to follow the manufacturer's guidelines for lead-free soldering profiles.

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