1SV325,H3F footprint, schematic symbol and 3D model by Toshiba

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1SV325,H3F Details

The recommended operating temperature range for the 1SV325,H3F is -40°C to 125°C.
To ensure reliability in high-temperature applications, it is recommended to derate the voltage and current ratings of the 1SV325,H3F according to the datasheet, and to provide adequate heat sinking and thermal management.
The maximum allowable power dissipation for the 1SV325,H3F is 1.5W, and it is recommended to derate the power dissipation according to the ambient temperature and thermal resistance of the device.
The 1SV325,H3F is a surface-mount device and should be handled according to standard surface-mount assembly procedures, including using a soldering iron with a temperature of 260°C or less, and avoiding excessive mechanical stress or bending.
The recommended storage condition for the 1SV325,H3F is in a dry, cool place, away from direct sunlight and moisture, and in its original packaging or an anti-static bag.

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Use the download button to access the 1SV325,H3F schematic symbol, PCB footprint, and 3D model.

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