1SX110HN3F43E2LPBK - Intel

1SX110HN3F43E2LPBK Details

• Manufacturer Part Number:

  1SX110HN3F43E2LPBK

• Part Life Cycle Code:

  Transferred

• Package Description:

  FBGA-1760

• Country Of Origin:

  Mainland China, Malaysia, Taiwan, USA, Vietnam

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Intel Corporation

• YTEOL:

  10

• JESD-30 Code:

  S-PBGA-B1760

• Length:

  42.5 mm

• Number of Inputs:

  704

• Number of Logic Cells:

  1325000

• Number of Outputs:

  704

• Number of Terminals:

  1760

• Operating Temperature-Max:

  100 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA1760,42X42,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  3.881 mm

• Supply Voltage-Max:

  0.88 V

• Supply Voltage-Min:

  0.82 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Technology:

  FINFET, 14 nm

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  42.5 mm