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2118-H-RC - Bourns

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2118-H-RC Details

  • Manufacturer Part Number:

    2118-H-RC

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Country Of Origin:

    Tunisia

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Construction:

    Hortizontal Mount

  • DC Resistance:

    0.23 Ω

  • Inductance-Nom (L):

    330 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Lead Diameter:

    0.5588 mm

  • Lead Spacing:

    19.304 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    21.844 mm

  • Package Length:

    11.43 mm

  • Package Style:

    Toroidal

  • Rated Current-Max:

    1.7 A

  • Shape/Size Description:

    CYLINDRICAL PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    NO

  • Terminal Placement:

    AXIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    15%

2118-H-RC Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • Bourns recommends using a human body model (HBM) ESD protection device, such as a TVS diode, in parallel with the 2118-H-RC to protect against electrostatic discharge. The ESD protection device should be rated for at least 2 kV.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, Bourns recommends derating the device's performance at temperatures above 100°C to ensure long-term reliability.
  • Yes, the 2118-H-RC is designed to withstand high-vibration environments. However, Bourns recommends securing the device to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and ensure reliable operation.
  • Bourns recommends following a systematic troubleshooting approach, starting with visual inspection of the device and PCB for signs of damage or contamination. Next, verify the device's pinout and connections, and then perform functional tests using a signal generator and oscilloscope.

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2118-H-RC Overview

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