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2309-1HPGGI - Renesas Electronics

Description: The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23

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2309-1HPGGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG16-+-+
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2309-1HPGGI Details

  • Manufacturer Part Number:

    2309-1HPGGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    2309

  • Input Conditioning:

    MUX

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    35 mA

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    133 MHz

2309-1HPGGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4331EJ0100) which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The 2309-1HPGGI also has a built-in overcurrent detection feature, but it's recommended to use an external circuit for more accurate detection.
  • Renesas recommends using a ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of 25V or higher, as the input capacitor. The capacitor should be placed as close as possible to the VIN pin of the 2309-1HPGGI.
  • Renesas provides EMC design guidelines in their application note (R01AN4331EJ0100) which include recommendations for PCB layout, component selection, and shielding to ensure EMC compliance.
  • The maximum ambient temperature for the 2309-1HPGGI is 105°C, but it's recommended to operate the device at a temperature below 85°C for optimal performance and reliability.

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