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2309-1HDCGI
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HDCGI |
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2309-1HPGG8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HPGG8 |
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2309-1HPGGI
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HPGGI |
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2309-1HDCG
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HDCG |
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2309-1HDCG8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HDCG8 |
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2309-1DCGI
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1DCGI |
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2309-1DCG
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1DCG |
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2309-1HPGG
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HPGG |
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2309-1HPGGI8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HPGGI8 |
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2309-1HDCGI8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1HDCGI8 |
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2309-1DCGI8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1DCGI8 |
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2309-1DCG8
Renesas Electronics
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1 | The 2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides nine low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2309 is available in two different versions. The 23 | Small Outline Packages | 2309-1DCG8 |
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CRCW0402309RFKTD
Vishay
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1 | Thick Film Resistors - SMD 1/16watt 309ohms 1% | Resistor Chip | CRCW0402309RFKTD |
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CY2309ZXI-1H
Infineon
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1 | Zero Delay Buffer | Small Outline Packages | CY2309ZXI-1H |
3
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SI2309CDS-T1-GE3
Vishay
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1 | MOSFET P-Channel 60V 1.2A SOT23 Vishay SI2309CDS-T1-GE3 P-channel MOSFET Transistor, 1.2 A, 60 V, 3-Pin SOT-23, TO-236 | SOT23 (3-Pin) | SI2309CDS-T1-GE3 |
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EVQ-V5102309B
Panasonic
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1 | Encoders 18pts Torq:18mN.m 9pulse Encoder | Other | EVQ-V5102309B |
2
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TLP2309(E)
Toshiba
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1 | Optocoupler DC-IN 1-CH Transistor With Base DC-OUT 5-Pin SO | Small Outline Packages | TLP2309(E) |
3
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2309412-1
TE Connectivity
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1 | Body Features: Ejector Type Locking | Module Key Type Offset Right | Ejector Location Both Ends | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Connector Profile High | Configuration Features: Number of Positions 260 | Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Other | 2309412-1 |
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2309409-2
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Type Locking | Connector Profile Low | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Number of Positions 260 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AM | Other | 2309409-2 |
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2309NZ-1HDCGI
Renesas Electronics
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1 | The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66 | Small Outline Packages | 2309NZ-1HDCGI |
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2309NZ-1HDCG8
Renesas Electronics
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1 | The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66 | Small Outline Packages | 2309NZ-1HDCG8 |
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TSW-123-09-T-S
SAMTEC
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1 | 23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-123-09-T-S |
2
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ERF8-023-09.0-L-DV-K-TR
SAMTEC
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1 | 46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket | Other | ERF8-023-09.0-L-DV-K-TR |
2
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TSW-123-09-FM-S
SAMTEC
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1 | 23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-123-09-FM-S |
2
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ERF8-023-09.0-L-DV-L-TR
SAMTEC
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1 | 46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket | Other | ERF8-023-09.0-L-DV-L-TR |
2
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