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LTC2309IUF#PBF - Analog Devices

Description: ADC 12-bit SAR Serial QFN24 EP Linear Technology LTC2309IUF#PBF, 12 bit Serial ADC, Differential Input, 10-Pin DFN

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LTC2309IUF#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UF (24-Lead QFN)
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LTC2309IUF#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - UF (24-Lead QFN)
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LTC2309IUF#PBF Details

  • Manufacturer Part Number:

    LTC2309IUF#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD, QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1697

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.048 V

  • Analog Input Voltage-Min:

    -2.048 V

  • Conversion Time-Max:

    1.8 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.014 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LTC2309IUF#PBF Frequently Asked Questions (FAQs)

  • A good layout and routing for the LTC2309IUF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To optimize the performance of the LTC2309IUF in a noisy environment, use a low-pass filter at the input, add a ferrite bead or a common-mode choke to the power supply lines, and use a shielded enclosure to reduce electromagnetic interference (EMI).
  • The maximum clock frequency that can be used with the LTC2309IUF is 100 MHz. However, the actual clock frequency may be limited by the specific application and the quality of the clock signal.
  • To ensure the accuracy and linearity of the LTC2309IUF, use a high-quality voltage reference, ensure proper PCB layout and routing, and calibrate the device using the built-in calibration feature or an external calibration signal.
  • The power consumption of the LTC2309IUF depends on the specific operating conditions, but typically ranges from 10 mW to 50 mW. The device has a low power shutdown mode that reduces power consumption to less than 1 μW.

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LTC2309IUF#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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