Description:Body Features: Bus Bar Contact Plating Material Silver | Configuration Features: Number of Positions 1 | Mating & Unmating Configuration Normal | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 200 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICM | Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thic
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About TE Connectivity
TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.
