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24AA64T-I/MC - Microchip

Description: 64K I2C Serial EEPROM

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24AA64T-I/MC - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-lead DFN-ren1
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24AA64T-I/MC - Microchip  - 3D model - Small Outline No-lead - 8-lead DFN-ren1
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24AA64T-I/MC Details

  • Manufacturer Part Number:

    24AA64T-I/MC

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24AA64T-I/MC Frequently Asked Questions (FAQs)

  • The 24AA64T-I/MC has a minimum of 1 million write cycles, but this can vary depending on the operating conditions and usage patterns.
  • To ensure data integrity, use the 24AA64T-I/MC's built-in power-on reset (POR) and brown-out detection (BOD) features. Additionally, implement a robust power-down sequence and consider using a voltage supervisor to monitor the power supply.
  • The recommended clock frequency for the 24AA64T-I/MC is up to 1 MHz, but it can operate at frequencies up to 3.4 MHz. However, higher frequencies may require additional capacitive loading and signal integrity considerations.
  • The 24AA64T-I/MC uses a page-based write architecture. For page writes, use the Write Enable (WREN) command followed by the Write (WR) command. For block writes, use the Write Enable (WREN) command followed by the Write (WR) command, and then repeat the process for each page within the block.
  • The WP (Write Protect) pin is used to prevent accidental writes to the device. When the WP pin is tied low, the device is in a write-protected state, and any write attempts will be ignored.

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24AA64T-I/MC Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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