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24LC32AF-E/SN - Microchip

Description: EEPROM 32K 4K X 8 2.5V SER EE EXT 1/4AWP

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24LC32AF-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SN
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24LC32AF-E/SN - Microchip  - 3D model - Small Outline Packages - SN
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24LC32AF-E/SN Details

  • Manufacturer Part Number:

    24LC32AF-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Mainland China, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Memory Density:

    32768 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.23

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

24LC32AF-E/SN Frequently Asked Questions (FAQs)

  • The 24LC32AF-E/SN has a minimum of 1 million write cycles, but the actual number of write cycles may vary depending on the application and usage.
  • The 24LC32AF-E/SN uses a page write buffer to handle page writes. The device can perform page writes of up to 32 bytes. For block writes, the device uses a block write buffer that can handle up to 128 bytes. The device automatically handles page and block writes based on the address and data provided.
  • The WP (Write Protect) pin is used to prevent writes to the entire device or a specific block of memory. When the WP pin is tied to VCC, the entire device is write-protected. When the WP pin is tied to a specific block address, only that block is write-protected.
  • The 24LC32AF-E/SN requires a specific power-up and power-down sequencing to ensure proper operation. The device should be powered up with VCC rising from 0V to the operating voltage, and powered down with VCC falling from the operating voltage to 0V.
  • The recommended operating voltage range for the 24LC32AF-E/SN is 2.5V to 5.5V. Operating the device outside of this range may affect its performance and reliability.

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24LC32AF-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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