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25LC040X-I/ST - Microchip

Description: EEPROM 512x8 - 2.5V Rot Pin

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25LC040X-I/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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3D Models
25LC040X-I/ST - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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25LC040X-I/ST Details

  • Manufacturer Part Number:

    25LC040X-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    1997-06-01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Clock Frequency-Max (fCLK):

    2 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

25LC040X-I/ST Frequently Asked Questions (FAQs)

  • The 25LC040X-I/ST has a minimum of 1,000,000 write cycles, but the actual number of write cycles may vary depending on the operating conditions and usage patterns.
  • The 25LC040X-I/ST uses a page write buffer to handle page writes. The device can write up to 128 bytes of data in a single page write operation, and the buffer is automatically cleared after each write operation.
  • The WP (Write Protect) pin is used to prevent writes to the status register and the memory array. When the WP pin is tied to VCC, the device is in write-protect mode, and any attempts to write to the status register or memory array will be ignored.
  • The 25LC040X-I/ST has a built-in power-up and power-down sequence that ensures the device is properly initialized and reset during power-up and power-down events. The device also has a low-voltage detect circuit that prevents writes to the memory array during power-up and power-down sequences.
  • The maximum clock frequency for the 25LC040X-I/ST is 5 MHz, but the device can operate at lower clock frequencies as well.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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