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25LC256-E/MF - Microchip

Description: Microchip 25LC256-E/MF, 256kb EEPROM Memory, 160ns 8-Pin DFN SPI

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25LC256-E/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 25LC256-E/MF-1
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25LC256-E/MF - Microchip  - 3D model - Small Outline No-lead - 25LC256-E/MF-1
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25LC256-E/MF Details

  • Manufacturer Part Number:

    25LC256-E/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DFN-S-8

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    OPERATES WITH 2.5VMIN @ 5MHZ

  • Clock Frequency-Max (fCLK):

    10 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE/SOFTWARE

25LC256-E/MF Frequently Asked Questions (FAQs)

  • The 25LC256-E/MF has a minimum of 1 million write cycles, but the actual number of write cycles can vary depending on the usage and operating conditions.
  • The 25LC256-E/MF uses a page write buffer to handle page writes. For block writes, you need to use the block write command and specify the starting address and number of bytes to write.
  • The WP (Write Protect) pin is used to prevent writes to the status register and the memory array. When the WP pin is tied low, the device is in a write-protected state.
  • You can implement a retry mechanism by checking the WIP (Write In Progress) bit in the status register. If the WIP bit is set, the device is busy with a write operation. You can retry the write operation after a short delay.
  • The recommended clock frequency for the 25LC256-E/MF is up to 5 MHz. However, the device can operate at higher frequencies, but with reduced reliability and performance.

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25LC256-E/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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