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25LC256-I/ST - Microchip

Description: Microchip 25LC256-I/ST Serial EEPROM Memory, 256kbit, 160ns, 2.5 → 5.5 V 8-Pin TSSOP

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25LC256-I/ST Details

  • Manufacturer Part Number:

    25LC256-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    10 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.5 V

  • Qualification Status:

    Not Qualified

  • Reverse Pinout:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.006 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE/SOFTWARE

25LC256-I/ST Frequently Asked Questions (FAQs)

  • The 25LC256-I/ST has a minimum of 1 million write cycles, but the actual number of write cycles may vary depending on the usage and operating conditions.
  • To ensure data retention, the 25LC256-I/ST should be powered within the recommended voltage range (2.5V to 5.5V) and operated within the recommended temperature range (-40°C to 125°C). Additionally, the device should not be exposed to extreme temperatures, humidity, or radiation.
  • The WP (Write Protect) pin is used to prevent accidental writes to the device. When the WP pin is tied to VCC, the device is in write-protect mode, and any attempt to write to the device will be ignored.
  • Yes, the 25LC256-I/ST can operate at 3.3V. The device is specified to operate from 2.5V to 5.5V, making it compatible with 3.3V systems.
  • During power-up, the 25LC256-I/ST should be powered up monotonically, with VCC rising from 0V to the operating voltage. During power-down, the device should be powered down monotonically, with VCC falling from the operating voltage to 0V.

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25LC256-I/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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