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25SEP33M - Panasonic

Description: Panasonic 33μF Polymer Capacitor 25V dc, Through Hole - 25SEP33M

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Symbol
25SEP33M - Panasonic - PCB symbol
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PCB Footprints
25SEP33M - Panasonic PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - 8*12-
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3D Models
25SEP33M - Panasonic - 3D model - Capacitor, Polarized Radial Diameter - 8*12-
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25SEP33M Details

  • Manufacturer Part Number:

    25SEP33M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    RADIAL LEADED, ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    0

  • Capacitance:

    33 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    8 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    30 mΩ

  • Leakage Current:

    0.413 mA

  • Length:

    12 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    Bulk

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Ripple Current:

    149 mA

  • Surface Mount:

    NO

  • Tan Delta:

    0.12

  • Terminal Pitch:

    3.5 mm

  • Terminal Shape:

    WIRE

25SEP33M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 25SEP33M is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
  • To handle thermal considerations, ensure a minimum of 2mm clearance around the component, use a thermal relief pattern on the PCB, and consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum operating temperature range for the 25SEP33M is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as screw mounting or adhesive bonding, and consider using a vibration-dampening material or potting compound.
  • The recommended soldering profile for the 25SEP33M is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less.

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25SEP33M Overview

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25SEP33M Alternates

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For a full list of alternate parts for 25SEP33M, check out Findchips.com