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25TQC22MYFT - Panasonic

Description: PANASONIC - 25TQC22MYFT - Tantalum Polymer Capacitor, 22 ?F, 25 V, POSCAP TQC Series, ? 20%, D, 0.07 ohm

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Symbol
25TQC22MYFT - Panasonic - PCB symbol
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PCB Footprints
25TQC22MYFT - Panasonic PCB footprint - Other - Other - D15
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3D Models
25TQC22MYFT - Panasonic - 3D model - Other - D15
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25TQC22MYFT Details

  • Manufacturer Part Number:

    25TQC22MYFT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Indonesia, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    1

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    22 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    70 mΩ

  • Height:

    1.4 mm

  • JESD-609 Code:

    e4

  • Leakage Current:

    0.055 mA

  • Length:

    7.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Ripple Current:

    1400 mA

  • Size Code:

    2917

  • Surface Mount:

    YES

  • Tan Delta:

    0.1

  • Terminal Finish:

    Palladium/Gold (Pd/Au)

  • Terminal Shape:

    J BEND

  • Width:

    4.3 mm

25TQC22MYFT Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 25TQC22MYFT is a rectangular pad with a size of 2.5mm x 1.6mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum operating temperature range for the 25TQC22MYFT is -40°C to 125°C. However, it's recommended to operate the component within the specified temperature range to ensure optimal performance and reliability.
  • Yes, the 25TQC22MYFT is designed to withstand high-vibration environments. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress and vibration-induced failures.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 300°C. Apply a small amount of solder paste to the pads, and use a soldering technique that minimizes thermal stress on the component.

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25TQC22MYFT Overview

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