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2DB1689-7 - Diodes Incorporated

Description: TRANSISTOR

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Symbol
2DB1689-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
2DB1689-7 - Diodes Incorporated PCB footprint - Other - Other - SOT65P210X110-3N
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3D Models
2DB1689-7 - Diodes Incorporated - 3D model - Other - SOT65P210X110-3N
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2DB1689-7 Details

  • Manufacturer Part Number:

    2DB1689-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    270

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

2DB1689-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the 2DB1689-7 should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces, and avoid vias under the device. A solid ground plane and a separate power plane can also help reduce noise and improve performance.
  • Proper thermal management is crucial for the 2DB1689-7. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation.
  • The 2DB1689-7 can operate safely within a temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • Yes, the 2DB1689-7 is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, which ensures the device can withstand the harsh conditions found in automotive environments.
  • The 2DB1689-7 requires proper power sequencing and startup to ensure reliable operation. Ensure that the input voltage (VIN) is applied before the enable signal (EN), and that the output voltage (VOUT) is stable before connecting the load.

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2DB1689-7 Overview

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