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2ED300C17-S - Infineon

Description: MOSFET DRVR 30A 2-OUT Non-Inv Tray - Bulk

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Symbol
2ED300C17-S - Infineon - PCB symbol
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PCB Footprints
2ED300C17-S - Infineon PCB footprint - Other - Other - 2ED300C17-S-3
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3D Models
2ED300C17-S - Infineon - 3D model - Other - 2ED300C17-S-3
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2ED300C17-S Details

  • Manufacturer Part Number:

    2ED300C17-S

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-XXMA-X

  • Length:

    72 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    30 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    14 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    16 V

  • Supply Voltage1-Min:

    14 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UNSPECIFIED

  • Turn-off Time:

    0.58 µs

  • Turn-on Time:

    0.67 µs

  • Width:

    60.5 mm

2ED300C17-S Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes a thermal pad and a specific copper area to ensure good heat dissipation.
  • Ensure good airflow around the device, use a heat sink if necessary, and follow the recommended PCB layout. Also, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the gate driver output is ±30V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the 2ED300C17-S can be used in a half-bridge configuration. However, ensure that the device is properly configured and the bootstrap capacitor is correctly sized to avoid voltage spikes.
  • Check the input voltage, ensure proper gate drive voltage, and verify that the device is properly configured. Also, check for any signs of overheating or electrical overstress.

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2ED300C17-S Overview

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