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2EDF7175FXUMA1 - Infineon

Description: Gate Drivers

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2EDF7175FXUMA1 Details

  • Manufacturer Part Number:

    2EDF7175FXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES WITH OUTPUT SUPPLY VOLTAGE VDDA 4.5 TO 20

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.044 µs

  • Turn-on Time:

    0.044 µs

  • Width:

    4 mm

2EDF7175FXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Infineon recommends following the soldering conditions outlined in their application note AN2013-02, which includes guidelines for reflow soldering, wave soldering, and hand soldering to ensure reliable assembly and minimize the risk of damage.
  • To troubleshoot issues with the internal temperature sensor, check the device's datasheet for the recommended diagnostic procedures, and consider using Infineon's evaluation boards and software tools to monitor and analyze the device's temperature sensor data.
  • Operating the device beyond its specified maximum ratings can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its specified ratings to maintain its performance and reliability.

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2EDF7175FXUMA1 Overview

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