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2EDN7523FXTMA1 - Infineon

Description: Gate Drivers DRIVER IC

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2EDN7523FXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-60-
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2EDN7523FXTMA1 Details

  • Manufacturer Part Number:

    2EDN7523FXTMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3.94 mm

2EDN7523FXTMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes. It's essential to follow these guidelines to ensure proper heat dissipation and minimize electromagnetic interference (EMI).
  • Choose a gate driver that matches the IGBT's voltage and current ratings. Consider factors like switching frequency, dead-time, and Miller plateau voltage. Infineon offers a range of gate drivers compatible with the 2EDN7523FXTMA1.
  • Monitor the IGBT's temperature, voltage, and current. Implement overcurrent protection (OCP), overvoltage protection (OVP), and overtemperature protection (OTP) to prevent damage. Use the built-in thermistor or external temperature sensors to monitor temperature.
  • Follow Infineon's guidelines for PCB layout, use shielding, and implement filtering and decoupling techniques to minimize EMI. Ensure proper grounding and bonding of the IGBT module and surrounding components.
  • Store the IGBT modules in a dry, cool place, away from direct sunlight. Handle the modules by the edges to prevent electrostatic discharge (ESD) damage. Use anti-static packaging and follow Infineon's recommended handling procedures.

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