SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Seated Height-Max:
1.04 mm
Supply Voltage-Max:
20 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Turn-off Time:
0.023 µs
Turn-on Time:
0.023 µs
Width:
3 mm
2EDN7523RXUMA1 Frequently Asked Questions (FAQs)
Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the 2EDN7523RXUMA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and to prevent thermal-related issues.
When selecting a gate driver for the 2EDN7523RXUMA1, consider factors such as the driver's output current capability, voltage rating, and propagation delay. Infineon recommends using their EiceDRIVER™ gate driver family, which is specifically designed to work with their IGBT modules. The 1EDI60N12AF and 1EDI60N12BF are suitable options for this module.
The 2EDN7523RXUMA1 is rated for operation up to 150°C. However, high temperatures can affect the module's performance, reliability, and lifespan. To ensure reliable operation, it's essential to implement a robust thermal management strategy, including heat sinks, thermal interfaces, and cooling systems. Additionally, consider derating the module's current and voltage ratings at high temperatures to prevent overheating and thermal runaway.
To protect the 2EDN7523RXUMA1 from overvoltage and overcurrent conditions, implement a robust protection circuit that includes features such as overvoltage protection (OVP), undervoltage protection (UVP), and overcurrent protection (OCP). Infineon recommends using their PROpeater™ protection ICs, such as the TLE4961G, which are specifically designed to work with their IGBT modules.
The 2EDN7523RXUMA1 is a high-power device that can generate electromagnetic interference (EMI). To ensure compliance with relevant EMI and EMC standards, such as IEC 61800-3, implement a robust EMI filter design, use shielding and grounding techniques, and follow good PCB layout practices. Infineon provides application notes and design guides that outline EMI and EMC considerations for their IGBT modules.
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2EDN7523RXUMA1 Overview
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