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2EDN7524FXTMA1 - Infineon

Description: Gate Drivers DRIVER IC

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2EDN7524FXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8-60
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2EDN7524FXTMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO-8-60
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2EDN7524FXTMA1 Details

  • Manufacturer Part Number:

    2EDN7524FXTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3.94 mm

2EDN7524FXTMA1 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink with a thermal interface material. Additionally, ensure good airflow and avoid blocking airflow around the device.
  • To ensure EMC compliance, follow Infineon's guidelines for PCB layout, component placement, and shielding. Use a shielded enclosure, and ensure proper grounding and bonding of the device. Additionally, consider using EMI filters and common-mode chokes to reduce emissions and susceptibility.
  • The 2EDN7524FXTMA1 is designed to meet high reliability standards. Infineon provides a reliability report that outlines the device's expected lifetime and failure rates. In general, the device is designed to operate for 15 years or more in typical automotive applications, with a failure rate of less than 10 FIT (failures per 10^9 hours).
  • For troubleshooting and debugging, use Infineon's recommended tools and software, such as the Infineon Toolbox or the 2EDN7524FXTMA1 evaluation board. Analyze the device's operating conditions, voltage and current waveforms, and temperature. Consult Infineon's application notes and technical support resources for guidance on specific issues.
  • When handling and using the 2EDN7524FXTMA1, follow proper electrostatic discharge (ESD) precautions, such as using an ESD wrist strap or mat. Ensure the device is properly soldered and handled to avoid mechanical stress. Follow Infineon's guidelines for safe operating conditions, and avoid exceeding the device's absolute maximum ratings.

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2EDN7524FXTMA1 Overview

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