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2EDN7524RXTMA1 - Infineon

Description: Two independent 5 A channels enable numerous deployment options

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2EDN7524RXTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSSOP-8-1_2022
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2EDN7524RXTMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSSOP-8-1_2022
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2EDN7524RXTMA1 Details

  • Manufacturer Part Number:

    2EDN7524RXTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.04 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3 mm

2EDN7524RXTMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Infineon recommends following the soldering conditions outlined in their application note AN2013-02, which includes guidelines for soldering temperature, time, and flux type to ensure reliable assembly and minimize the risk of damage.
  • To protect the device from ESD, it's essential to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the system design, such as TVS diodes or ESD protection arrays.
  • The internal ESD protection of the 2EDN7524RXTMA1 is designed to protect the device from ESD events, but it may also affect the system design. Engineers should consider the internal ESD protection when designing the system's ESD protection scheme to avoid conflicts or overvoltage conditions.

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2EDN7524RXTMA1 Overview

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