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2EDR7259XXUMA1 - Infineon

Description: Dual-channel isolated gate driver ICs in 300 mil DSO package

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2EDR7259XXUMA1 - Infineon PCB footprint - Other - Other - 2EDR7259XXUMA1-5
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2EDR7259XXUMA1 - Infineon  - 3D model - Other - 2EDR7259XXUMA1-5
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2EDR7259XXUMA1 Details

  • Manufacturer Part Number:

    2EDR7259XXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Indonesia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14/16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.046 µs

  • Turn-on Time:

    0.047 µs

  • Width:

    7.5 mm

2EDR7259XXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal management guidelines for the 2EDR7259XXUMA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and to prevent thermal-related issues.
  • Infineon offers a gate driver selection tool on their website, which helps engineers choose the most suitable gate driver for their application based on parameters like voltage, current, and package type. Additionally, consulting with an Infineon FAE (Field Application Engineer) or a local distributor can provide valuable insights and recommendations.
  • Key parameters to monitor include junction temperature (Tj), gate-source voltage (Vgs), drain-source voltage (Vds), and drain current (Id). Regularly monitoring these parameters can help identify potential issues before they become critical, ensuring reliable operation and preventing premature failure.
  • Yes, Infineon provides guidelines for EMI/EMC design considerations in their application notes and datasheets. It's essential to follow these guidelines to minimize electromagnetic interference and ensure compliance with relevant standards. Additionally, using simulation tools and consulting with EMI/EMC experts can help identify and mitigate potential issues.
  • Infineon provides specific storage and handling guidelines in their datasheets and packaging information documents. It's crucial to follow these guidelines to prevent damage from electrostatic discharge, moisture, and mechanical stress, ensuring long-term reliability and performance.

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