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2N4340 - InterFET

Description: JFET N-Channel -50V Low Ciss

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PCB Footprints
2N4340 - InterFET PCB footprint - Other - Other - TO-18
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2N4340 - InterFET  - 3D model - Other - TO-18
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2N4340 Details

  • Manufacturer Part Number:

    2N4340

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    InterFET Corporation

  • Case Connection:

    GATE

  • Configuration:

    SINGLE

  • Drain-source On Resistance-Max:

    1500 Ω

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    3 pF

  • JEDEC-95 Code:

    TO-18

  • JESD-30 Code:

    O-MBCY-W3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

2N4340 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the 2N4340 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the boundaries of the maximum ratings and ensure that the device does not exceed the maximum junction temperature (Tj) of 150°C.
  • To ensure the 2N4340 is properly biased for linear operation, you should follow the recommended biasing scheme outlined in the datasheet. This typically involves setting the base-emitter voltage (Vbe) to around 0.7V and the collector-emitter voltage (Vce) to a value that allows the device to operate within its linear region. You may also need to adjust the biasing resistors to achieve the desired quiescent current (Icq).
  • The recommended PCB layout and thermal management for the 2N4340 involve using a thermally conductive PCB material, placing the device on a heat sink or thermal pad, and ensuring good airflow around the device. You should also minimize the thermal resistance between the device and the heat sink by using a thermal interface material (TIM) and ensuring good contact between the device and the heat sink.
  • To handle ESD protection for the 2N4340, you should follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that the device is stored in an ESD-safe environment. You may also want to consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to your circuit design to protect the 2N4340 from electrostatic discharge.
  • The reliability and failure rate expectations for the 2N4340 are typically specified in the device's reliability report or datasheet. However, as a general rule, the failure rate of the 2N4340 can be estimated using the Arrhenius equation, which takes into account factors such as temperature, voltage, and current. You can also consult with the manufacturer or a reliability expert to get a more accurate estimate of the device's reliability and failure rate.

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2N4340 Overview

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Part Image 2N4340 Texas Instruments

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Part Image 2N4340 NXP Semiconductors

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