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2N4856 - InterFET

Description: JFET N-Channel -40V Low Noise

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PCB Footprints
2N4856 - InterFET PCB footprint - Other - Other - TO-18
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3D Models
2N4856 - InterFET  - 3D model - Other - TO-18
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2N4856 Details

  • Manufacturer Part Number:

    2N4856

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    TO-18, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    InterFET Corporation

  • Case Connection:

    GATE

  • Configuration:

    SINGLE

  • Drain-source On Resistance-Max:

    25 Ω

  • FET Technology:

    JUNCTION

  • JEDEC-95 Code:

    TO-18

  • JESD-30 Code:

    O-MBCY-W3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Power Dissipation-Max (Abs):

    0.36 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

2N4856 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 2N4856 is -55°C to 150°C, although it's recommended to operate within -40°C to 125°C for optimal performance.
  • To ensure proper biasing, make sure to provide a stable voltage supply, typically between 10V to 30V, and ensure the gate-source voltage (Vgs) is within the recommended range of -2V to 2V. Additionally, use a suitable gate resistor to prevent oscillations.
  • A simple gate drive circuitry can be implemented using a voltage divider network and a gate resistor. A more advanced approach would be to use a dedicated gate driver IC, such as the TC4420, to provide a high-current, low-impedance drive signal.
  • To protect the 2N4856 from overvoltage, use a voltage clamp or a zener diode to limit the voltage across the device. For overcurrent protection, consider using a current sense resistor and a comparator to detect excessive current, and then use a switch or a fuse to disconnect the power supply.
  • For optimal thermal management, ensure good heat dissipation by using a heat sink, thermal interface material, and a PCB with a solid copper ground plane. Keep the device away from high-impedance nodes and use a star-grounding configuration to minimize noise and EMI.

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