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2N6394 - onsemi

Description: SCRs 50V 12A

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2N6394 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 2N6394
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2N6394 Details

  • Manufacturer Part Number:

    2N6394

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    CASE 221A-07, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    CASE 221A-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • DC Gate Trigger Current-Max:

    30 mA

  • DC Gate Trigger Voltage-Max:

    2.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e0

  • Leakage Current-Max:

    2 mA

  • Non-Repetitive Pk On-state Cur:

    100 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    5000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    50 V

  • Repetitive Peak Reverse Voltage:

    50 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SCR

2N6394 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the 2N6394 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. A safe operating area can be defined as the region where the device can operate without exceeding its maximum ratings. For the 2N6394, this region is typically bounded by the maximum voltage rating (VCE = 400V), maximum current rating (IC = 10A), and maximum power dissipation (PD = 115W).
  • To ensure the 2N6394 is properly biased for linear operation, you should follow these guidelines: 1) Choose a suitable collector-emitter voltage (VCE) that is high enough to ensure the device is operating in the linear region, but not so high that it approaches the maximum voltage rating. 2) Select a base-emitter voltage (VBE) that is within the recommended range (typically around 0.7V). 3) Ensure the base current (IB) is sufficient to maintain the desired collector current (IC), but not so high that it causes excessive power dissipation. 4) Use a suitable biasing network, such as a voltage divider or a current mirror, to establish a stable bias point.
  • The recommended heatsink design for the 2N6394 depends on the specific application and operating conditions. However, here are some general guidelines: 1) Choose a heatsink with a high thermal conductivity (e.g., copper or aluminum). 2) Ensure the heatsink has a sufficient surface area to dissipate the maximum power dissipation (PD) of the device. 3) Use a thermal interface material (TIM) with a low thermal resistance to improve heat transfer between the device and heatsink. 4) Consider using a forced-air cooling system or a heat pipe to enhance heat dissipation. 5) Perform thermal simulations or testing to validate the heatsink design and ensure it meets the required thermal performance.
  • While the 2N6394 is primarily designed for linear applications, it can be used in switching applications with some caution. However, you should be aware of the following limitations: 1) The device has a relatively high saturation voltage (VCE(sat)) of around 2V, which can lead to increased power losses in switching applications. 2) The 2N6394 has a moderate switching speed, with a typical rise time (tr) of around 10ns and a fall time (tf) of around 20ns. 3) The device may not be optimized for high-frequency switching, and its performance may degrade at high frequencies. 4) You should carefully evaluate the device's switching characteristics and ensure it meets the requirements of your specific application.
  • To protect the 2N6394 from electrical overstress (EOS) and electrostatic discharge (ESD), follow these guidelines: 1) Ensure the device is operated within its recommended voltage and current ratings. 2) Use a suitable voltage clamp or surge protector to limit voltage transients. 3) Implement a robust ESD protection scheme, such as a diode-based or resistor-based protection network. 4) Handle the device with care, using anti-static wrist straps, mats, and packaging materials. 5) Follow proper PCB design and layout practices to minimize the risk of EOS and ESD damage.

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