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2SAR586D3FRATL - ROHM Semiconductor

Description: PNP, TO-252 (DPAK), -80V -5A, Power Transistor for Automotive

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Symbol
2SAR586D3FRATL - ROHM Semiconductor - PCB symbol
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PCB Footprints
2SAR586D3FRATL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
2SAR586D3FRATL - ROHM Semiconductor - 3D model - Other - TO-252 (DPAK)_Master
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2SAR586D3FRATL Details

  • Manufacturer Part Number:

    2SAR586D3FRATL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-06-22

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    5 A

  • Collector-Base Capacitance-Max:

    100 pF

  • Collector-Emitter Voltage-Max:

    80 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    120

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    10 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    200 MHz

  • VCEsat-Max:

    0.32 V

2SAR586D3FRATL Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal management system to keep the junction temperature below 150°C. Also, follow the recommended derating curves for voltage and current.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more details.
  • Yes, the 2SAR586D3FRATL is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended design and testing guidelines for these applications.
  • The 2SAR586D3FRATL has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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2SAR586D3FRATL Overview

Use the download button to access the 2SAR586D3FRATL schematic symbol, PCB footprint, and 3D model.
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