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2SCR552P5T100 - ROHM Semiconductor

Description: NPN, SOT-89, 30V 3A, Medium Power Transistor

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2SCR552P5T100 - ROHM Semiconductor - PCB symbol
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2SCR552P5T100 - ROHM Semiconductor PCB footprint - Other - Other - MPT3
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2SCR552P5T100 - ROHM Semiconductor - 3D model - Other - MPT3
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2SCR552P5T100 Details

  • Manufacturer Part Number:

    2SCR552P5T100

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-62, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2016-04-06

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    280 MHz

2SCR552P5T100 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Yes, the 2SCR552P5T100 is designed for high-reliability applications. It has undergone rigorous testing and meets the requirements of AEC-Q101, a standard for automotive-grade semiconductor devices.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and electrical connections. Use oscilloscopes and other diagnostic tools to identify issues.

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2SCR552P5T100 Overview

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