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2SD1048-7-TB-E - onsemi

Description: Ultrasmall package allows miniaturization in end products; Large current capacity (IC=0.7A) and low-saturation voltage

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2SD1048-7-TB-E - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 2SD1048-7-TB-E
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2SD1048-7-TB-E - onsemi  - 3D model - SOT23 (3-Pin) - 2SD1048-7-TB-E
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2SD1048-7-TB-E Details

  • Manufacturer Part Number:

    2SD1048-7-TB-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-59 / CP

  • Package Description:

    SC-59, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318BJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.7 A

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    300

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

2SD1048-7-TB-E Frequently Asked Questions (FAQs)

  • The maximum SOA for the 2SD1048-7-TB-E is typically defined by the voltage and current ratings, but it's recommended to consult the application notes or contact onsemi support for specific guidance on SOA.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consult the datasheet for thermal resistance and junction-to-case thermal resistance values.
  • For optimal performance and thermal management, it's recommended to follow onsemi's application notes and PCB layout guidelines, which provide guidance on pad layout, thermal vias, and heat sink design.
  • To protect the transistor from ESD, it's essential to follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, consider implementing ESD protection circuits in your design.
  • For reliable assembly and soldering, follow onsemi's recommended soldering profiles and techniques, which include using a soldering iron with a temperature range of 250°C to 260°C, and ensuring a soldering time of less than 3 seconds.

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2SD1048-7-TB-E Overview

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