Description:Support is limited to customers who have already adopted these products.A wide variety of products are rolled out, for example, for uses at high temperature (up to 175°C applicable), high power, and low Vce (sat), and others.
Renesas recommends a PCB layout with a large copper area connected to the tab of the transistor to improve thermal dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the transistor. Additionally, ensure that the device is properly mounted on a heat sink, and the thermal interface material is applied correctly to minimize thermal resistance.
Handle the transistor by the body, not the leads, to prevent damage. Store the devices in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and do not touch the leads or pins with bare hands to prevent electrostatic discharge (ESD) damage.
Select a heat sink with a thermal resistance (Rth) that is compatible with the transistor's thermal characteristics. Consider factors such as the heat sink's material, size, and shape, as well as the airflow and ambient temperature of the application. Renesas provides thermal resistance data in the datasheet to aid in heat sink selection.
Renesas recommends soldering the transistor using a soldering iron with a temperature of 350°C (662°F) or less, and a soldering time of 3 seconds or less. Use a solder with a melting point of 183°C (361°F) or higher, and ensure that the soldering process is performed in a clean, dry environment.
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2SD986-AZ Overview
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