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2STR1230 - STMicroelectronics

Description: 2STR1230, NPN Bipolar Transistor, 1.5 A 30 V HFE:80 Power, 3-Pin SOT-23

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Symbol
2STR1230 - STMicroelectronics - PCB symbol
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PCB Footprints
2STR1230 - STMicroelectronics PCB footprint - Other - Other - SOT-23_reverse
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3D Models
2STR1230 - STMicroelectronics - 3D model - Other - SOT-23_reverse
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2STR1230 Details

  • Manufacturer Part Number:

    2STR1230

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MINIATURE, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Collector Current-Max (IC):

    1.5 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

2STR1230 Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • A ceramic capacitor with a value of 1-10uF and a voltage rating of 50V or higher is recommended. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • Use a voltage regulator with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, consider adding a fuse or a polyfuse in series with the input voltage to protect against overcurrent conditions.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). This ensures that the internal voltage regulator is stable before the device is enabled.

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2STR1230 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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