Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure proper thermal management, minimize parasitic inductance, and optimize performance.
To minimize electromagnetic interference (EMI), keep the inductor at least 5 mm away from sensitive components. You can also use shielding techniques, such as copper tape or mu-metal shielding, to contain the magnetic field.
While the datasheet specifies a maximum rated voltage, it's essential to consider the voltage stress during transient events, such as inrush current or voltage spikes. As a general rule, keep the voltage stress below 1.5 times the rated voltage to ensure reliability.
The SRF is typically not specified in the datasheet. To determine the SRF, use a network analyzer or a spectrum analyzer to measure the inductor's impedance vs. frequency. The SRF can affect the inductor's performance, especially in high-frequency applications.
The inductor's thermal resistance (Rth) is specified in the datasheet. Ensure good thermal contact between the inductor and the PCB, and consider using thermal vias or heat sinks to dissipate heat. Keep the ambient temperature below the maximum rated temperature to prevent thermal runaway.
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3313J-1-201E Overview
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