Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
While the 3386P-1-100 is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature applications. Consult with Bourns' application engineers for specific guidance.
Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure reliable connections. Avoid excessive soldering temperatures and times to prevent damage to the component.
Store the 3386P-1-100 in its original packaging or a similar ESD-protective container to prevent damage from electrostatic discharge. Handle the component by the body, avoiding touching the pins or leads to prevent damage or contamination.
While the 3386P-1-100 is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) and take necessary precautions to prevent moisture-related failures. Consult with Bourns' application engineers for specific guidance.
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3386P-1-100 Overview
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