3D3D16G72WB2723IB - 3D Plus

3D3D16G72WB2723IB Details

• Manufacturer Part Number:

  3D3D16G72WB2723IB

• Part Life Cycle Code:

  Contact Manufacturer

• Package Description:

  BGA-199

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  3D PLUS

• Access Mode:

  SINGLE BANK PAGE BURST

• Additional Feature:

  AUTO/SELF REFRESH, IT ALSO REQUIRES 1.5V SUPPLY

• Clock Frequency-Max (fCLK):

  667 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B199

• Length:

  30 mm

• Memory Density:

  19327352832 bit

• Memory IC Type:

  DDR3 DRAM MODULE

• Memory Width:

  72

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  199

• Number of Words:

  268435456 words

• Number of Words Code:

  256000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256MX72

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA199,13X20,50

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Refresh Cycles:

  8192

• Seated Height-Max:

  6.7 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.25 A

• Supply Current-Max:

  1.1 mA

• Supply Voltage-Max (Vsup):

  1.575 V

• Supply Voltage-Min (Vsup):

  1.283 V

• Supply Voltage-Nom (Vsup):

  1.35 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Total Dose:

  75k Rad(Si) V

• Width:

  22 mm