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3EZ13D5-TP - MCC

Description: Zener Diodes

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PCB Footprints
3EZ13D5-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - 30KP78CA-TP
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3D Models
3EZ13D5-TP - MCC  - 3D model - Diodes, Axial Diameter Horizontal Mounting - 30KP78CA-TP
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3EZ13D5-TP Details

  • Manufacturer Part Number:

    3EZ13D5-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-15

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.65

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    4.5 Ω

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    700 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    13 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    58 mA

3EZ13D5-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 3EZ13D5-TP can be found in the Micro Commercial Components' application note AN-113, which provides guidelines for PCB layout and assembly.
  • The 3EZ13D5-TP has a thermal resistance of 10°C/W. To ensure proper thermal management, it's recommended to use a heat sink or a thermal pad, and to follow the guidelines in the datasheet for maximum power dissipation.
  • The 3EZ13D5-TP has an operating temperature range of -40°C to 125°C. However, it's recommended to derate the component's power handling capability at higher temperatures to ensure reliability.
  • The 3EZ13D5-TP is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support or to consult with Micro Commercial Components' application engineers for customized solutions.
  • The 3EZ13D5-TP should be stored in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%. It's also recommended to store the components in their original packaging to prevent damage.

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3EZ13D5-TP Overview

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