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3EZ16D5-TP - MCC

Description: Zener Diodes

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PCB Footprints
3EZ16D5-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - 3EZ16D5-TP
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3D Models
3EZ16D5-TP - MCC  - 3D model - Diodes, Axial Diameter Horizontal Mounting - 3EZ16D5-TP
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3EZ16D5-TP Details

  • Manufacturer Part Number:

    3EZ16D5-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-15

  • Package Description:

    PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.65

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    5.5 Ω

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    700 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    47 mA

3EZ16D5-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 3EZ16D5-TP can be found in the IPC-7351 standard or in the Micro Commercial Components' application note AN-1131.
  • The thermal pad should be connected to a copper plane on the PCB to ensure proper heat dissipation. A thermal relief pattern is recommended to prevent solder wicking during reflow.
  • The maximum operating temperature range for the 3EZ16D5-TP is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, the 3EZ16D5-TP is designed to withstand high-vibration environments. However, it's recommended to follow proper PCB design and assembly guidelines to ensure the component is securely attached to the board.
  • Follow the recommended soldering profile and ensure the component is properly aligned during assembly. A soldering temperature of 260°C (max) and a dwell time of 3-5 seconds are recommended.

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3EZ16D5-TP Overview

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