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3SMAJ5935B-TP - MCC

Description: Zener Diodes

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Symbol
3SMAJ5935B-TP - MCC - PCB symbol
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PCB Footprints
3SMAJ5935B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA-ren3
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3D Models
3SMAJ5935B-TP - MCC - 3D model - Diodes Moulded - SMA-ren3
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3SMAJ5935B-TP Details

  • Manufacturer Part Number:

    3SMAJ5935B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    23 Ω

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    700 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    27 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    13.9 mA

3SMAJ5935B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMAJ5935B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure optimal reliability, handle the 3SMAJ5935B-TP by the body, avoid touching the leads, and minimize bending or flexing of the leads. It is also recommended to store the devices in a dry, cool place, away from direct sunlight and moisture.
  • The maximum allowable power dissipation for the 3SMAJ5935B-TP is dependent on the ambient temperature and the thermal resistance of the device. Refer to the datasheet for the power derating curve and thermal resistance values to determine the maximum allowable power dissipation for your specific application.
  • The 3SMAJ5935B-TP is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing and qualification. It is recommended to consult with Micro Commercial Components or a qualified reliability engineer to determine the suitability of the device for your specific application.
  • The 3SMAJ5935B-TP can be soldered using a soldering iron or a reflow oven. The recommended soldering temperature is between 250°C to 260°C, and the soldering time should not exceed 3 seconds. It is essential to follow the recommended soldering profile and to use a solder with a melting point below 220°C to prevent thermal damage to the device.

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3SMAJ5935B-TP Overview

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