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3SMBJ5921B-TP - MCC

Description: Zener Diodes

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3SMBJ5921B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3SMBJ5921B-TP - MCC  - 3D model - Diodes Moulded - smb
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3SMBJ5921B-TP Details

  • Manufacturer Part Number:

    3SMBJ5921B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2.5 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    55.1 mA

3SMBJ5921B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5921B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper soldering and avoid defects, follow the recommended soldering profile and temperature, use a solder with a melting point compatible with the component's rating, and ensure the PCB is clean and free of oxidation. Additionally, use a soldering iron with a temperature control and a flux suitable for the component's package type.
  • The maximum allowable power dissipation for the 3SMBJ5921B-TP is dependent on the ambient temperature and the thermal resistance of the component. According to the datasheet, the maximum power dissipation is 1500 W, but this value may decrease as the ambient temperature increases. It is essential to calculate the power dissipation and ensure it is within the safe operating area to prevent overheating and component failure.
  • The 3SMBJ5921B-TP is a commercial-grade component, and its use in high-reliability or aerospace applications may require additional testing and qualification. It is recommended to consult with Micro Commercial Components or a qualified reliability engineer to determine the component's suitability for such applications.
  • To prevent ESD damage, handle the 3SMBJ5921B-TP with anti-static wrist straps, mats, or gloves, and store it in anti-static packaging or bags. Ensure the workspace is ESD-protected, and avoid touching the component's pins or leads. Follow the ESD handling and storage guidelines outlined in the ANSI/ESD S20.20 standard.

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3SMBJ5921B-TP Overview

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