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3SMBJ5937B-TP - MCC

Description: Zener Diodes

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Symbol
3SMBJ5937B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5937B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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3D Models
3SMBJ5937B-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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3SMBJ5937B-TP Details

  • Manufacturer Part Number:

    3SMBJ5937B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    800 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    11.4 mA

3SMBJ5937B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5937B-TP can be found in the Micro Commercial Components' application note or packaging specification document, which provides detailed guidelines for PCB layout and assembly.
  • The 3SMBJ5937B-TP's thermal management and heat dissipation can be handled by providing a sufficient heat sink, using thermal interface materials, and ensuring good airflow around the device. The device's thermal resistance and power dissipation ratings should be considered when designing the thermal management system.
  • The 3SMBJ5937B-TP meets various reliability and quality standards, including AEC-Q101, IEC 61000-4, and ISO 9001. These standards ensure that the device meets certain requirements for performance, reliability, and quality.
  • Yes, the 3SMBJ5937B-TP can be used in high-reliability or safety-critical applications, but it's essential to follow the manufacturer's guidelines and recommendations for design, testing, and validation. Additionally, the device's failure modes and effects analysis (FMEA) should be considered to ensure that it meets the required safety and reliability standards.
  • Troubleshooting issues with the 3SMBJ5937B-TP requires a systematic approach, including checking the device's datasheet, application notes, and technical support resources. It's essential to verify the device's operating conditions, PCB layout, and assembly quality to identify the root cause of the issue.

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3SMBJ5937B-TP Overview

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