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3SMBJ5941B-TP - MCC

Description: Zener Diodes

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3SMBJ5941B-TP - MCC - PCB symbol
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PCB Footprints
3SMBJ5941B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
3SMBJ5941B-TP - MCC - 3D model - Diodes Moulded - smb
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3SMBJ5941B-TP Details

  • Manufacturer Part Number:

    3SMBJ5941B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    67 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    47 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    8 mA

3SMBJ5941B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the 3SMBJ5941B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the 3SMBJ5941B-TP by the body only, avoiding touching the leads or the glass diode. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the component during assembly.
  • The maximum allowable voltage derating for the 3SMBJ5941B-TP is typically 10-15% below the maximum rated voltage. However, it is recommended to consult the datasheet or contact Micro Commercial Components for specific derating guidelines, as excessive derating can affect the component's reliability and performance.
  • The 3SMBJ5941B-TP is rated for operation up to 150°C. However, it is essential to consider the component's power dissipation, thermal resistance, and the surrounding environment's temperature when operating in high-temperature conditions. Consult the datasheet or contact Micro Commercial Components for specific guidance on using the component in high-temperature environments.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines in the datasheet or in the IPC-J-STD-020 standard. Use a solder with a melting point below 260°C, and avoid applying excessive heat or force during the soldering process. Inspect the solder joints for proper wetting, and verify the component's functionality after soldering.

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3SMBJ5941B-TP Overview

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