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46015-0803 - Molex

Description: Mini-Fit Plus Header, Dual Row, Vertical, 8 Circuits, with Snap-in Plastic Peg PCB Lock, without Drain Holes, PA Polyamide Nylon 6/6, UL 94V-0

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Symbol
46015-0803 - Molex - PCB symbol
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PCB Footprints
46015-0803 - Molex PCB footprint - Other - Other - 46015-08(03,07,09)
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3D Models
46015-0803 - Molex - 3D model - Other - 46015-08(03,07,09)
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46015-0803 Details

  • Manufacturer Part Number:

    46015-0803

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    6.87

  • Connector Type:

    RECTANGULAR POWER CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    Tin (Sn)

  • Contact Material:

    NOT SPECIFIED

  • DIN Conformance:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e3

  • MIL Conformance:

    NO

46015-0803 Frequently Asked Questions (FAQs)

  • The recommended torque for the screw terminals is 0.5-0.7 Nm (4.4-6.3 in-lbs).
  • Yes, the 46015-0803 is designed to withstand vibrations and can be used in applications with moderate to high vibration levels.
  • The 46015-0803 has a IP67 rating, making it suitable for outdoor use and providing protection against dust and water ingress.
  • The operating temperature range for the 46015-0803 is -40°C to 105°C (-40°F to 221°F).
  • No, the 46015-0803 is designed for use with wire gauges 18 AWG to 24 AWG. Using a larger wire gauge may not provide a secure connection.

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46015-0803 Overview

Use the download button to access the 46015-0803 schematic symbol, PCB footprint, and 3D model.
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About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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