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47156 - MYRRA

Description: MYRRA - 47156 - POWER SUPPLY, 5W 24VDC REG

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PCB Footprints
47156 - MYRRA PCB footprint - Other - Other - 47156-2
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3D Models
47156 - MYRRA  - 3D model - Other - 47156-2
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47156 Details

  • Manufacturer Part Number:

    47156

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    PACKAGE-9/4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Myrra

  • Additional Feature:

    ALSO REQUIRE 85V TO 370V DC VOLTAGE

  • Analog IC - Other Type:

    AC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    265 V

  • Input Voltage-Min:

    85 V

  • JESD-30 Code:

    R-XDMA-P4

  • Length:

    31.7 mm

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    50 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Voltage-Max:

    24.48 V

  • Output Voltage-Min:

    23.52 V

  • Output Voltage-Nom:

    24 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    22.3 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    5 mm

  • Terminal Position:

    DUAL

  • Total Power Output-Max:

    5 W

  • Trim/Adjustable Output:

    NO

  • Width:

    26.7 mm

47156 Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern around the device is recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients and hotspots.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure.
  • Yes, but additional testing and validation may be required to ensure the device meets the specific requirements of the application.
  • Use a systematic approach to troubleshoot, checking for proper power supply, signal integrity, and thermal management, and consult the datasheet and application notes for guidance.

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47156 Overview

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