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4816P-1-201LF - Bourns

Description: RES ARRAY 8 RES 200 OHM 16SOIC

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4816P-1-201LF - Bourns - PCB symbol
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4816P-1-201LF - Bourns PCB footprint - Small Outline Packages - Small Outline Packages - 4816P
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4816P-1-201LF - Bourns - 3D model - Small Outline Packages - 4816P
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4816P-1-201LF Details

  • Manufacturer Part Number:

    4816P-1-201LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOM-16

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Costa Rica

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.16 W

  • First Element Resistance:

    200 Ω

  • JESD-609 Code:

    e2

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.03 mm

  • Package Length:

    5.59 mm

  • Package Style:

    SOIC

  • Package Width:

    11.18 mm

  • Packing Method:

    TR, 13 INCH

  • Rated Power Dissipation (P):

    1.28 W

  • Rated Temperature:

    70 °C

  • Resistance:

    200 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    200 Ω

  • Size Code:

    2244

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Temperature Coefficient Tracking:

    50 ppm/°C

  • Terminal Finish:

    TIN COPPER

  • Terminal Shape:

    GULL WING

  • Tolerance:

    2%

  • Working Voltage:

    50 V

4816P-1-201LF Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering, thermal management, and to minimize parasitic effects.
  • The datasheet provides thermal resistance values (RθJA and RθJC). To handle thermal considerations, ensure proper heat sinking, use thermal interface materials, and follow recommended PCB layout and design guidelines. Additionally, consider using thermal simulation tools to optimize your design.
  • Bourns recommends following the IPC-J-STD-020 standard for soldering. The recommended soldering temperature profile is typically between 235°C to 245°C, with a peak temperature of 260°C. It's essential to follow these guidelines to prevent damage to the component.
  • To ensure EMC and EMI compliance, follow proper PCB design guidelines, use shielding and grounding techniques, and consider using EMI filters or common-mode chokes. Additionally, perform EMC and EMI testing to validate your design.
  • The 4816P-1-201LF has an MSL rating of 1, which means it's sensitive to moisture. To handle it, follow proper storage and handling guidelines, use dry packing or desiccant, and ensure the component is baked according to the manufacturer's recommendations before soldering.

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4816P-1-201LF Overview

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