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4N25-X009T - Vishay

Description: Transistor Output Optocouplers Phototransistor Out Single CTR>20%

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Symbol
4N25-X009T - Vishay - PCB symbol
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PCB Footprints
4N25-X009T - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SMD-6, option 9_2022
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3D Models
4N25-X009T - Vishay - 3D model - Small Outline Packages - SMD-6, option 9_2022
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4N25-X009T Details

  • Manufacturer Part Number:

    4N25-X009T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    20%

  • Current Transfer Ratio-Nom:

    50%

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    5300 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

4N25-X009T Frequently Asked Questions (FAQs)

  • The 4N25-X009T can operate from -40°C to 100°C, but the maximum junction temperature is 125°C.
  • Ensure the input current is within the recommended range (5-20 mA) and the output voltage is within the specified range (VCC - 1.5V to VCC + 0.5V).
  • The typical propagation delay time is around 2-3 μs, but it can vary depending on the specific application and operating conditions.
  • The 4N25-X009T is not suitable for high-frequency applications (>10 kHz) due to its limited bandwidth and potential for oscillations. Consider using a high-speed optocoupler like the 6N137 or 7N137 for such applications.
  • Use proper PCB layout techniques, such as separating the input and output circuits, using shielding, and adding bypass capacitors to minimize EMI and RFI effects.

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4N25-X009T Overview

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