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5.0SMDJ7.5CAS - LITTELFUSE

Description: The 5.0SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events, Bi-directional

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PCB Footprints
5.0SMDJ7.5CAS - LITTELFUSE PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - DO-214AB (SMC J-BEND) -2020
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3D Models
5.0SMDJ7.5CAS - LITTELFUSE  - 3D model - Diodes Moulded Non Polarised - DO-214AB (SMC J-BEND) -2020
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5.0SMDJ7.5CAS Details

  • Manufacturer Part Number:

    5.0SMDJ7.5CAS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    9.21 V

  • Breakdown Voltage-Min:

    8.33 V

  • Breakdown Voltage-Nom:

    8.77 V

  • Clamping Voltage-Max:

    12.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    5000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Reference Standard:

    IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    7.5 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

5.0SMDJ7.5CAS Frequently Asked Questions (FAQs)

  • The recommended land pattern for 5.0SMDJ7.5CAS is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask clearance of 0.2mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • While 5.0SMDJ7.5CAS has a high-temperature rating of 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum junction temperature (Tj) of 150°C. Additionally, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
  • To prevent damage during assembly, handle the 5.0SMDJ7.5CAS by the body only, avoiding touching the leads or the glass diode. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Also, ensure that the component is not subjected to excessive mechanical stress, such as bending or flexing.
  • While 5.0SMDJ7.5CAS is a surface-mount device, it's designed to withstand moderate vibration levels. However, in high-vibration environments, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent component detachment or damage.
  • The typical lead time for 5.0SMDJ7.5CAS can vary depending on the supplier, quantity, and availability. However, as a general guideline, the lead time is usually around 4-6 weeks for standard quantities. It's recommended to check with the supplier or distributor for the most up-to-date lead time information.

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5.0SMDJ7.5CAS Overview

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