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5005930700 - Molex

Description: 2.50mm Pitch CP-2.5 Mini Wire-to-Wire Plug Housing, Single Row, 7 Circuits

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5005930700 - Molex  - 3D model
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5005930700 Details

  • Manufacturer Part Number:

    5005930700

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Molex

  • YTEOL:

    7.25

  • Body Breadth:

    0.37 inch

  • Body Depth:

    0.898 inch

  • Body Length:

    0.811 inch

  • Body/Shell Style:

    PLUG

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    NOT APPLICABLE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    20 mΩ

  • Filter Feature:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Mating Contact Pitch:

    0.098 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Type:

    CABLE

  • Number Of Connectors:

    ONE

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Reference Standard:

    UL

  • Termination Type:

    CRIMP

  • Total Number of Contacts:

    7

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5005930700 Overview

Use the download button to access the 5005930700 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 50059, or try a keyword search, such as Headers and Edge Type Connectors

About Molex

Molex is a global manufacturer of connectivity solutions for various industries. The company offers a wide range of products including connectors, cables, antennas, sensors, and integrated systems. Molex's products are used in diverse applications such as automotive, telecommunications, data centers, consumer electronics, industrial automation, medical devices, and aerospace.

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